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APDS-9003
Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description
The APDS-9003 is a low cost analog-output ambient light photo sensor in miniature chipLED lead-free surface mount package. It consists of a spectrally suited photo sensor, which provides excellent responsivity that is close to the response of the human eyes, as shown in figure 2. The APDS-9003 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly.
Features
* Excellent responsivity Close responsivity to the human eye * Miniature ChipLed Leadfree surface-mount package: Height - 0.55mm Width - 1.60mm Depth - 1.50mm * Low sensitivity variation across various light sources * Operating temperature: -400C to 850C * Vcc supply 2.4 to 5.5V * ROHS compliant and Lead Free Package
Application Support Information
The Application Engineering Group is available to assist you with the application design associated with APDS9003 ambient light photo sensor module. You can contact them through your local sales representatives for additional details.
Applications
* Detection of ambient light to control display backlighting Mobile devices - Mobile phones, PDAs Computing devices - Notebooks, Webpads Consumer devices - TVs, Video Cameras, Digital Still Cameras * Automatic Residential and Commercial Lighting Management * Electronic Signs and Signals
Ordering Information
Part Number APDS-9003-020 Packaging Type Tape and Reel Package 6-pins Chipled package Quantity 2500 Remarks No Binning
Binning Available
Other binning options are available. Please contact your Avago Technologies representative for information on current available bins
Typical Application Circuit
Relative Spectral Response
Pin 1:VCC
1.2 Eye 1.0 0.8 0.6 0.4 0.2 0 350 APDS-9003
Pin 6:OUT
APDS-9003
Pin 2,3,4,5 : NC
RLOAD
Component Rload
Recommended Application Circuit Component 1k
550
750 950 Wavelength (nm)
1150
Figure 2: Relative Spectral Response Vs Wavelength Figure 1: Typical application circuit for APDS-9003
I/O Pins Configuration Table
Pin 1 2 3 4 5 6 Symbol VCC NC NC NC NC Out Description VCC No Connect No Connect No Connect No Connect Out
Absolute Maximum Ratings
Parameter Storage Temperature Supply Voltage Symbol TS VCC Min. -40 0 Max. 85 6 Units C V
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
2
Recommended Operating Conditions
Parameter Operating Temperature Supply Voltage Symbol TA VCC Min. -40 2.4 Max. 85 5.5 Units C V Conditions
Electrical & Optical Specifications (Ta=25C)
Parameter Output Current Output Current Output Current Dark Current Light Current Ratio
[4] [4] [4]
Symbol I_OUT1 I_OUT2 I_OUT3 I_DARK I_OUT3 / I_OUT2 Tr Tf Icc Vo
Min. 6.3 90 -
Typ. 19 230 276 50 1.2
Max. 31 370 160 -
Units uA uA uA nA -
Conditions Vcc=3.0V,Lux=10 Vcc=3.0V,Lux=100 Vcc=3.0V,Lux=100 Vcc=3.0V,Lux=0 [Note 2] [Note 2] [Note 1]
Rise Time Fall Time Supply Current Saturation Output Voltage Peak Sensitivity Wavelength Propagation Delay time Storage Delay time
2.2 -
0.95 0.8 2.5 2.32 620 600 200
2 2 -
ms ms mA V nm us us
Vcc=3.0V,Lux=100,Rload=1k [Note 3] Vcc=3.0V,Lux=100,Rload=1k [Note 3] Vcc=3.0V, LUX=1K [Note 3] Vcc=3.0V, LUX=100, Rload=1M
td ts
-
Vcc=3.0V, LUX=100,Rload=1k Vcc=3.0V, LUX=100,Rload=1k
Note: 1. Illuminance by CIE standard light source (Incandescent lamp) 2. Fluorescent light is used as light source. White LED is substituted in mass production. 3. White LED is used as light source. 4. Other binning options are available. Please contact your Avago Technologies representative for information on current available bins
Light Measurement Circuit and Waveforms
I_pulse Pin 1:VCC I_pulse
Pin 6:OUT APDS-9003
VOUT 90% GND 10% tr td ts tf
Pin 2,3,4,5 : NC
RLOAD
3
2.5 2.0
1.10 Relative Iout 1.08
Relative output current
100
Relative Iout(A)
1.06 1.04 1.02 1.00 0.98
1.5 1.0 0.5 Relative Iout 0 -50 -25 0 25 Temp(C) 50 75
0.96 2 3 4 Vcc (V) 5 6
Relative Output Current Vs Temp (Vcc = 3.0V, 100 Lux)
Relative Output Current Vs Vcc (Ta =25C, 100 Lux)
1.20 Relative output current Switching Time(sec) -90 -60 -30 0 Angle 30 60 90 1.00
4.0E-3 3.5E-3 3.0E-3 2.5E-3 2.0E-3 1.5E-3 1.0E-3
Relative Iout
0.80 0.60 0.40 0.20
500.0E-6
0.00
000.0E+0 0 2000 Rload (ohm) Average Trise Average Tpropagation_delay Average Tfall Average Tstoragedelay 4000 6000
Relative Iout Vs Angle (Vcc=3V, Ta=25C)
Switching Charecteristics (TA = 25C, Vcc = 3V)
Average Iout Vs Lux (Vcc=3V, T=25C, White LED source) 10000 Average Bin 1
Average Iout (uA)
1000
Average Bin 2 Average No Binning
100
10
1 10 100 Lux 1000
Average Iout Vs Lux (Vcc = 3V, T = 25C, White LED source)
4
APDS-9003 Package Outline
3 R0.15 0.07 2 1 Unit : mm Tolerance : 0.1 1.600.05
4 Marking
5 1.500.05
6
;;; ;;;;;;; ;; ;; ;; ;
0.370.05 0.35 0.8 0.35 1. 2. 3. 4. 5. 6. 0.25 0.3
0.25
;;;; ;;;;;
Light receiving area (0.505mm x 0.360mm)
0.180.05
0.550.1
0.35
Pin Configuration VCC NC NC NC NC OUT
0.35
0.25
5
APDS-9003 Tape and Reel Dimension
Unit : mm
4.000.10
1.750.05
0.250.03
2.000.05
n1
80.10
+0 .50
.1
0
3 2 1
; ;;; ;;;;;;;;;;;; ;; ;; ;; ; ; ; ; ;; ;;;;;;;;;;;; ;; ; ; ; ; ; ;; ; ;; ; ; ; ;; ;;
1.750.10
3.50.05
0.700.05
3~Max
40.1 n1.000.1
Marking
4
5
6
Orentation in the Tape and Reel 1.650.05
3~Max
PROGRESSIVE DIRECTION
Material of Carrier Tape : Conductive Polystrene Material of Cover Tape : PVC Method of Cover : Heat Sensitive Adhesive
(40 mm MIN)
EMPTY PARTS MOUNTED LEADER
(400 mm MIN)
EMPTY
(40 mm MIN)
"B" "C" 178 75 UNIT : mm
18.4 (max.)
0.50 2.0
DETAIL A
Di
a.
C
13 .0 0.5
B
LABEL
R1.0
0
20.2(min.)
DETAIL A
15.4 (max)
6
Moisture Proof Packaging
All APDS-9003 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3.
Units in A Sealed Mositure-Proof Package
Baking Conditions:
If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts.
Package In Reel In Bulk Temperature 60C 100C Time 48 hours 4 hours
Baking should only be done once. Recommended Storage Conditions:
Package Is Opened (Unsealed)
Storage Temperature Relative Humidity
Time from unsealing to soldering:
10C to 30C below 60% RH
Environment less than 30 deg C, and less than 60% RH ?
After removal from the bag, the parts should be soldered within 168 hours if stored at the recommended storage conditions. If times longer than 168 hours are needed, the parts must be stored in a dry box.
Yes
No Baking Is Necessary
Yes
Package Is Opened less than 168 hours ?
No No
Perform Recommended Baking Conditions
7
Recommended Reflow Profile
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9003 castellation pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and APDS-9003 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F).
Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255C (491F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed 6C per second maximum. This limitation is necessary to allow the PC board and APDS-9003 castellations to change dimensions evenly, putting minimal stresses on the APDS-9003.
MAX 260C R3 R4
255
T - TEMPERATURE ( C)
230 220 200 180 160 120 80 25 0 P1 HEAT UP 50 R1
R2
60 sec MAX Above 220 C
R5
100 P2 SOLDER PASTE DRY
150
200 P3 SOLDER REFLOW
250 P4 COOL DOWN
300 t-TIME (SECONDS)
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T 25C to 160C 160C to 200C 200C to 255C (260C at 10 seconds max) 255C to 200C 200C to 25C
Maximum T/ time 4C/s 0.5C/s 4C/s -6C/s -6C/s
8
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
Metal Stencil For Solder Paste Printing
1.2 Recommended Metal Solder Stencil Aperture It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printed solder paste volume and no shorting.
Aperture Opening
Stencil Aperture
Land Pattern Solder Mask PCBA
0.11
1.6 1.7
Figure 1: Stencil and PCBA Figure 3: Solder Stencil Aperture
Unit: mm
1.1 Recommended Land Pattern 1.3 Adjacent Land Keepout and Solder Mask Areas
C L 0.4
Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid Photo-Imageable solder resist/mask is recommended.
2.6
0.3
0.45 0.9
Mounting Center
2.
0.4
0.2
Figure 2: Recommended Land Pattern
0.4
Unit: mm 0.2 MIN. Figure 4: Adjacent Land Keepout and Solder Mask Areas
9
Appendix B: Optical Window Design for APDS-9003
2.0 Optical Window Dimensions To ensure that the performance of the APDS-9003 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS9003. This minimum dimension that is recommended will ensure at least a 35 light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure 5a and 5b illustrate the two types of window that we have recommended which could either be a flat window or a flat window with light pipe. Table 1 and Fgure 6 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0mm with a refractive index 1.585.
D1 Top View T
WD
L
D2 D1
Z APDS-9003 Light Receving Area
Figure 6: Recommended Window Dimensions
WD: Working Distance between window front panel & APDS-9003 D1: Window Diameter T: L: Z: Thickness Length of Light Pipe Distance between window rear panel and APDS9003
D2: Light Pipe Diameter
Figure 5(a): Window Size Determination for Flat Window
Figure 5(b): Window Design of Flat Window with Light Guide
10
Table 1: Recommended dimension for optical window
WD (T+L+Z) Z 1.5 2.0 2.5 3.0
All dimensions are in mm
Flat Window (L=0.0) D1 2.25 3.25 4.25 5.00
Flat window with Light Pipe (D2=1.5; Z =0.5) D1 2.5 L 1.5
0.5 1.0 1.5 2.0
The window should be placed directly on top of the photo sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5mm to optimize the performance of APDS-9003. 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. Table 2: Recommended Plastic Materials
Material number Makrolon LQ2647 Makrolon LQ3147 Makrolon LQ3187
Visible light transmission 87% 87% 85%
Refractive index 1.587 1.587 1.587
11
Appendix C: General Application Guide for APDS-9003
The APDS-9003 is a low cost analog-output ambient light photo sensor whose spectral response closely emulates the human eyes. APDS-9003 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9003 can easily be integrated into systems that use ADC input which is available for sampling of the external source, as shown in figure 7 below. The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increase the output voltage. Brightness is measured as "LUX" unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for "LUX" measurement. Light sources with the same LUX level appear at the same brightness to the human eyes.
Vcc
Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. APDS9003 allows a saturation output voltage of typically 2.32V @ VCC=3V. Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which act as a low-pass filter, is recommended to add in parallel with the load resistor to reduce the ripples.
1 Light Source APDS-9003 6 Vout A/D
2,3,4,5
C NC
RL
microcontroller
Figure 7: Configuration of APDS-9003
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Pte. All rights reserved.
AV01-0238EN - June 8, 2006

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